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Cu Copper microPowder 99.5%, 800 nm, metal basis

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Cu Copper microPowder 99.5%, 800 nm, metal basis

Cu Copper microPowder 99.5%, 800 nm, metal basis

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Copper (Cu) Powder Features:
ITEM NO Appearance Particle size Purity SSA Morphology True Density
Cu-P1 Red-brown 0.3um-150um 99.5% (metal basis) 2 m2/g near spherical 8.9 g/cm3

Copper (Cu) Powder(Cu) Powder Assay:

AS

Cd

Hg

Pb

Ni

Fe

Sn

Sb

Mn

Zn

<10ppm

<10ppm

<10ppm

<10ppm

<90ppm

<170ppm

<30ppm

<10ppm

<47ppm

<54ppm

Copper (Cu) Powder Applications:
1. The electronic size with good performance made of copper nanopowder instead of valuable metal particles cuts cost to a large extent;
2. This technology is used to the preference of microelectronic processes; 
3. Conductive pastes;
4. Cu Nanoparticles are high thermal conductivity materials;
5. Nanometal Lubricant additives: Adding 0.1~0.6% of copper nanopowder to lubricant oil and lubricant grease. It will form a self-lubricating and self-repairing coating film in the frictioning surface and lower its anti-friction and anti-wear performance;
6. The superficial conductive coating processing of metal and non-ferrous metal; Medicine append material;
7. Capacitor materials;
8. Cu Nanoparticles Lubricant additives;
9. Efficacious catalyst: Copper and copper alloy nanometer, feature high efficacy and selectivity, can be used as catalyst in some reactions, e.g. carbon dioxide compound hydrogen to produce methanol; Cu Nanoparticles used as Conductive coatings;
10. Raw material for bulk nanomaterial: Adopt the inert gas to make bulk copper nano composite material with powder metallurgy;
11. Cu Nanoparticles widelly used as Catalysts;
12. Conductive inks;
13. Conductive slurry: The copper nanopowder can be applied to the productiion of MLCC internal electrode and other electronic components in electronic slurry for the miniaturization of microelectronic devices;

Copper (Cu) Powder Storage Conditions:
Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the Copper (Cu) Nanoparticles should be avoided under stress. 

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