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SiC Silicon Carbide Nanoparticles Beta, 0.6,0.8,2,7,10,20

SiC Silicon Carbide Nanoparticles  Beta, 0.6,0.8,2,7,10,20

SiC Silicon Carbide Nanoparticles Beta, 0.6,0.8,2,7,10,20

Detailed


Silicon Carbide Nanoparticles (SiC, beta, 99+%) Features:

ITEM NO Appearance Particle size Purity Heating Power (KJ/mol) Hardness Density (288k) Compressibility Coefficient Thermal Expansion Coefficient Thermal Expansion Coefficient Decomposition Temperature Free Carbon
SiC-P1 black 600nm 99+% 30.343 9.5 Mohs 3.216 g/cm3 0.21x10-6 2.98x10-6 at 1173k 6.58x10-6 at 373k 2973k <0.05%
SiC-P2 black 800nm 99+% 30.343 9.5 Mohs 3.216 g/cm3 0.21x10-6 2.98x10-6 at 1173k 6.58x10-6 at 373k 2973k <0.05%
SiC-P3 black 1-40um  adjustable 99+% 30.343 9.5 Mohs 3.216 g/cm3 0.21x10-6 2.98x10-6 at 1173k

6.58x10-6 at 373k

2973k <0.05%

Silicon Carbide Nanoparticles (SiC, beta, 99+%) Certificate of Analysis-%
ITEM NO Al Fe Ca
SiC-P1 0.016 0.059 0.047
SiC-P2 0.018 0.057 0.050
SiC-P3 0.018 0.057 0.050

Silicon Carbide Nanoparticles (SiC, beta, 99+%) Storage Conditions:
1. Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air.
2. In addition, the product should be avoided under stress.

 

Silicon Carbide Nanoparticles (SiC, beta, 99+%)  Applications:
1. Catalyst support;
2. Mirror or coatings for extreme ultraviolet environment;
3. Nanocomposites (e.g., Si3N4/SiC, SiC/polymer);
4. Resistance heating elements;
5. High-temperature and high-power semiconductors;
6. High-temperature ceramic bearings;
7. Strengthening materials for Al, Al2O3, Mg, and Ni.
8. Ceramic engine parts;
9. Grinding wheels;
10. Hard disc and a support for multichip modules;
11. High-temperature fluid transport parts;
12. High hardness grinding materials;
13. Textile ceramics;
14. High-frequency ceramics;
15. High-temperature sealing valves;
16. High-grade refractory material;
17. Special use material for polishing abrasive;  
18. Ceramic bearings;  
19. Integrated circuit substrate;
20. High-temperature spray nozzles;

 

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