SiC 45-65nm, 600/800nm 99%
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Detailed
Silicon Carbide Nanopowder (SiC) 45-65nm
Purity: 99+%
APS: 45-65nm
APS: 45-65nm
Color: Grayish white
Bulk Density: 0.05 g/cm3
Bulk Density: 0.05 g/cm3
True Density: 3.216 g/cm3
Morphology: cubic
SSA: 40-80 m2/g
Zeta Potential: -27.8mV
Nanoparticle
Features:
|
Purity |
Free Si |
Free C |
|
99% |
0.24% |
0.76% |
Silicon Carbide Nanoparticles (SiC 99%) 600nm
Silicon Carbide Nanoparticles APS 600nm
Free Carbon <0.05%
Decomposition Temperature: 2973k
Thermal Expansion Coefficient: 6.58x10-6 at 373k
Thermal Expansion Coefficient: 2.98x10-6 at 1173k
Compressibility Coefficient: 0.21x10-6
Density (288k): 3.216 g/cm3
Hardness: 9.5 Mohs
Heating Power (KJ/mol): 30.343
|
Silicon Carbide Nanoparticles (SiC, beta, 99+%) Certificate of Analysis-%
|
||
| Al | Fe | Ca |
| 0.016 | 0.059 |
0.047 |
Silicon Carbide Sub-MicronPowder (SiC 99+%) 800nm
D<1 um / APS 800nm
Crystal Type: Beta
Free Carbon <0.05%
Decomposition Temperature: 2973k
Thermal Expansion Coefficient: 6.58x10-6 at 373k
Thermal Expansion Coefficient: 2.98x10-6 at 1173k
Compressibility Coefficient: 0.21x10-6
Density (288k): 3.216 g/cm3
Hardness: 9.5 Mohs
Heating Power (KJ/mol): 30.343
|
Silicon Carbide Sub-MicronPowder (SiC, beta, 99+%) Certificate of Analysis-%
|
||
| Al | Fe | Ca |
| 0.016 | 0.059 | 0.047 |
Features:
1. The product possesses high purity, narrow range particle size distribution, and larger specific surface area; 2. This product has chemical stability, high thermal conductivity, smaller thermal expansion coefficient and better abrasion resistance; 3. Its microhardness is 2840 ~ 3320kg/mm2 and hardness is between corundum and diamond; Its mechanical strength is higher than the corundum; 4. nano-SiC possesses excellent thermal conductivity. It is a semiconductor and resistant to oxidation in high temperature.
Applications:
High-grade refractory material; Special use material for polishing abrasive; Ceramic bearings; Ceramic engine parts; Grinding wheels; Textile ceramics; High-frequency ceramics; Hard disc and a support for multichip modules; High-temperature and high-power semiconductors; High-temperature ceramic bearings; High-temperature fluid transport parts; High hardness grinding materials; High-temperature sealing valves; High-temperature spray nozzles; Integrated circuit substrate; Catalyst support; Mirror or coatings for extreme ultraviolet environment; Nanocomposites (e.g., Si3N4/SiC, SiC/polymer); Resistance heating elements; Strengthening materials for Al, Al2O3, Mg, and Ni,etc.
High-grade refractory material; Special use material for polishing abrasive; Ceramic bearings; Ceramic engine parts; Grinding wheels; Textile ceramics; High-frequency ceramics; Hard disc and a support for multichip modules; High-temperature and high-power semiconductors; High-temperature ceramic bearings; High-temperature fluid transport parts; High hardness grinding materials; High-temperature sealing valves; High-temperature spray nozzles; Integrated circuit substrate; Catalyst support; Mirror or coatings for extreme ultraviolet environment; Nanocomposites (e.g., Si3N4/SiC, SiC/polymer); Resistance heating elements; Strengthening materials for Al, Al2O3, Mg, and Ni,etc.
Storage Conditions:
Damp reunion will affect its dispersion performance and using effects, therefore, this product should be sealed in vacuum and stored in cool and dry room and it should not be exposure to air. In addition, the product should be avoided under stress.