TiB2 Titanium Boride MicroPowder,2-12um
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Detailed
Titanium Boride MicroPowder Performance:
1. It is a new ceramic material. And it has excellent physical and chemical performance. Such as high melting point ( 2980 °C), high hardness ( 34 GPa), and its density is 4.52 g/cm3.
2. It could stand wear and tear, also resist acid-alkali. Its electric performance is good (P=14.4μΩ.cm), heat-conducting property is strong (25J/m.s.k).
3. And it has excellent chemical stability and thermal shock resistant performance.
4. Titanium diboride and its composite materials are innovative and high technology materials that were widely concerned and putative that has promotional value and application prospect.
Titanium Boride MicroPowder Features:
ITEM NO | Appearance | Particle size |
TiB2 |
Ti
|
B
|
C
|
O
|
Fe
|
True Density |
TiB2-P1 | Grey | 2-12um |
98+% |
>67.5%
|
>30.50%
|
<1.5%
|
<1%
|
<0.2
|
4.52 g/cm3 |
Titanium Boride MicroPowder Applications:
1. Electrical conductivity composite materials--Electrical conduction boron nitride named evaporation boat made by titanium diboride and boron nitride is the primary member for vacuum aluminizing equipment;
2. Ceramic cutting tools and their components--Titanium diboride ceramic is used for metal wortles, extrusion dies, sandblasting nozzles, potted components and cutting tools;
3. Aluminum electrolysis’ cathode materials--Because of the good wet ability of TIB2 and metal aluminum liquid.
4. It makes the electrolytic aluminum’s power consumption become low, then the electrolytic bath's life will be long.
5. It may also make up PIC exothermic materials and flexibility PIC materials, and it is the intensify reagent of the metal materials such as Al, Fe and Cu.
6. Composite ceramic materials--It could be used as multi-element composite materials’ important constituent element.
7. It can be made up cutting tools’ composite materials with TIC, TIN or SIC. And it is as a component to make armor protection materials. It is the best materials for thermo stability components and function devices;