AlN 65-75nm, 500/800nm 99.5% Hexagonal
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Aluminum Nitride Nanopowder (AlN, hexagonal) 65-75nm
Purity: 99.5%
APS: 65-75 nm
SSA: 40-80 m2/g
SSA: 40-80 m2/g
Color: gray
Zeta Potential: 44.7mV
Bulk Density: 0.05g/cm3
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1
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Aluminum Nitride Nanoparticles (AlN) Certificate of Analysis--%
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| N | O | C | Fe | Si | Ca | Cl |
| >33 | <0.5 | <0.04 | <0.01 | <0.045 | <0.009 | <0.0004 |
Performance:
1. High purity, small particle size distribution, large specific surface area, high surface activity, low bulk density, good performance of injection molding; 2. For composite materials, and good match with the semiconductor silicon, interface compatibility, and can improve the mechanical properties of composite materials and the thermal conductivity of dielectric.
Application:
Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers), etc.
Aluminum Nitride Powder (AlN, hexagonal) 500/800nm
AlN Purity: 99.5%
AlN APS: 800nm & 500nm
AlN Color: gray
AlN Zeta Potential: 44.7mV
AlN Making Method: Physical methods.
Thermal conductivity value 320w/mk
Thermal expansion coefficient: 3.5 × 10-6K-1
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Aluminum Nitride Powder (AlN) Certificate of Analysis--%
|
||||||
| N | O | C | Fe | Si | Ca | Cl |
| >33 | <0.5 | <0.04 | <0.01 | <0.045 | <0.009 | <0.0004 |
Applications:
Manufacturing integrated circuit board, electronic devices, optical devices, radiator, high temperature crucible; Fabrication of metal matrix and polymer matrix composites, especially in the heat seal adhesives and electronic packaging materials have wide application; High thermally conductive ceramics; Composite ceramics, e.g. evaporation boats; Heat sinks; Electrically insulating packages for electronics; Crucibles for metals and salt melts; Thermally conductive filler for polymers; Components for wafer processing ( chucks, carriers),etc.